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Qualcomm announced two new sound platforms for wireless mid-tier and premium earbuds, headphones, and speakers that allow manufacturers to include audiophile-level sound quality, enhanced ANC, improved call quality, and lower power consumption across a broader range of Bluetooth audio products.
Manufacturers use Qualcomm's chipsets and audio platforms in some of our favorite wireless audio products and sell them under brands like Bose, Sennheiser, Anker, Jabra, and more. The new audio platforms are divided into two tiers and come just five months after Qualcomm updated its ultra-premium tier, the Snapdragon S7 and S7 Pro.
The Snapdragon S3 Gen 3 and S5 Gen 3 audio platforms will soon be available to manufacturers, so let's break down how they could change our Bluetooth audio experiences.
These new chips provide more on-device AI that can listen to your surrounding noise levels and "understand and adapt to user needs throughout the day," according to Qualcomm. In this sense, on-device AI should make the new chips' adaptive ANC more intuitive and valuable.
Compared to the S5 Gen 2, the new generation audio platform will support 50% more memory and will have double the computing power to process audio signals. This improvement means that headphones with this audio chip should improve voice recognition, spatial audio, EQ settings, and noise cancellation.
The tiny chips in your headphones use machine-learning algorithms to process the noises around you and provide adaptive noise-canceling based on your environment's noise levels. Qualcomm's new chips should allow these algorithms to work smarter and faster, as the chipmaker says this generation's ANC is its strongest yet.
The S5 Gen 3 platform also promises ultra-low power consumption, which should prolong the battery life of its headphones and earbuds. The new chips can also hold up to 5MB of RAM, compared to the previous generation's 2.64MB.
Manufacturers use Qualcomm's chipsets and audio platforms in some of our favorite wireless audio products and sell them under brands like Bose, Sennheiser, Anker, Jabra, and more. The new audio platforms are divided into two tiers and come just five months after Qualcomm updated its ultra-premium tier, the Snapdragon S7 and S7 Pro.
The Snapdragon S3 Gen 3 and S5 Gen 3 audio platforms will soon be available to manufacturers, so let's break down how they could change our Bluetooth audio experiences.
Qualcomm S5 Gen 3 Sound Platform
Like many tech innovations this year, Qualcomm's new audio chips include new AI-powered features, and the S5 Gen 3 platform debuts with an AI-powered neural processing unit (NPU). In theory, using AI in the NPU should allow headphones to process features like noise-canceling, transparency, and external noise management faster, more efficiently, and with less power consumption.These new chips provide more on-device AI that can listen to your surrounding noise levels and "understand and adapt to user needs throughout the day," according to Qualcomm. In this sense, on-device AI should make the new chips' adaptive ANC more intuitive and valuable.
Compared to the S5 Gen 2, the new generation audio platform will support 50% more memory and will have double the computing power to process audio signals. This improvement means that headphones with this audio chip should improve voice recognition, spatial audio, EQ settings, and noise cancellation.
The tiny chips in your headphones use machine-learning algorithms to process the noises around you and provide adaptive noise-canceling based on your environment's noise levels. Qualcomm's new chips should allow these algorithms to work smarter and faster, as the chipmaker says this generation's ANC is its strongest yet.
The S5 Gen 3 platform also promises ultra-low power consumption, which should prolong the battery life of its headphones and earbuds. The new chips can also hold up to 5MB of RAM, compared to the previous generation's 2.64MB.